| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_44ff3005508304394801e265e503b811 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4644
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0179 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2001-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35f1c40ad505e5fe027dac9790bac674
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a238226227bd5d44c0acaf0b4bb0de3f |
| publicationDate |
2002-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2002084456-A1 |
| titleOfInvention |
Multilayered wiring board and production method thereof |
| abstract |
There are provided a multilayered wiring board for a wafer batch contact board and production method thereof which can form condensers at low costs without changing the volume of the board (area and height, particularly height). The multilayered wiring board is a multilayered wiring board which constitutes a portion of a wafer batch contact board or the like used for testing a plurality of semiconductor devices formed on a wafer simultaneously and which has the structure that wiring patterns laminated via an insulating layer are connected (or conducted) to each other via a contact hole formed in the insulating layer, wherein condensers 11 are formed between the wiring patterns in the multilayered wiring layer integrally. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10186570-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015364537-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010264951-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8222532-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004106235-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8330480-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7045393-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004106288-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005186794-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7465354-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8786059-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8623737-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7700477-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8236615-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011121469-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011253422-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9339255-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005215905-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008124522-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7968458-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006201415-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007228517-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9476914-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007190776-A1 |
| priorityDate |
2000-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |