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publicationDate 2010-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2010264951-A1
titleOfInvention Interconnection card for inspection, manufacture method for interconnection card, and inspection method using interconnection card
abstract Recesses are formed on one surface of a substrate. A conductive film covers an inner surface of each of the recesses. This conductive film contacts a bump of a semiconductor device to be inspected and is electrically connected to the bump. It is therefore possible to prevent damages of the bump to be caused by contact of a probe pin.
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