| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ad3c1181dab5bf7fadd7fb2a1fc33d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_27d7c0a59e0be5139cd17d40db63d186
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6fde58cfa9c5619de975068295cd2fba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af190ddee39ba347a5e88316d757172
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c670c346fdee04441c99948611d306b5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f1b55de8245b94d8a781dae25cc106db |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3142 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2009-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a606fe55d77404d5e562a42fdfca24c4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_917cce836a3c3f725597c8d00b21ed75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b23ac7e52ee82536c8d879f773bfe4d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1113a5ed1ef228aa9f43cf84ecfca07c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_928b625cb7e005ff4ea57f4bfffdc98b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d793b55379dc34f3e02659fc5958d986 |
| publicationDate |
2012-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8236615-B2 |
| titleOfInvention |
Passivation layer surface topography modifications for improved integrity in packaged assemblies |
| abstract |
A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9798088-B2 |
| priorityDate |
2009-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |