| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-10 |
| filingDate |
2001-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03e2b16b927cdba6b840ca02d010923d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e610ab483ed54b5249893837406d555
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e26ade7bb062d19a8f9940bcd96912b |
| publicationDate |
2002-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2002051942-A1 |
| titleOfInvention |
Photo-or heat-curable resin composition and multilayer printed wiring board |
| abstract |
This invention relates to a photo- or heat-curable resin composition which yields a cured product with minimal cracking and high reliability. The resin composition of this invention comprises 100 parts by weight of the resin-forming component containing a photo- or heat-polymerizable unsaturated compound and 0.01-5 parts by weight of an inorganic filler such as silica sol with its average particle diameter controlled in the range 5 nm-0.5 μm. The composition exhibits high heat resistance and good microfabrication quality and is useful as a peripheral material of electronic parts such as semiconductor devices by the build-up process, for example, as a material for forming insulation layers in multilayer printed wiring boards. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015189758-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11445613-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7267840-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7524606-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007148442-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006267252-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013064890-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004131970-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10548224-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007141510-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013105440-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004022935-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1508834-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1508834-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009267263-A1 |
| priorityDate |
2000-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |