| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89afae566b725ae78e20cf972d9bcdc7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0783
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0076 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F299-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L31-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate |
1987-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1988-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f56523e12ad49886ee9280e548374938
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7f055bc871841f67cb44b1ad19dc048 |
| publicationDate |
1988-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-4786579-A |
| titleOfInvention |
Heat-resistant photosensitive resin composition |
| abstract |
The inventive photosensitive resin composition has excellent heat resistance, adhesiveness to substrate surface and photosensitivity and suitable as a material for solder resist or plating resist on printed circuit boards. The resin composition comprises, in addition to a photopolymerization initiator and curing agent for epoxy resins, a resinous ingredient composed of a diallyl phthalate resin, a first esterified resin as a reaction product of a cresol novolac type epoxy resin and 0.2-0.8 mole per mole of epoxy groups of an ethylenically unsaturated carboxylic acid and a second esterified resin as a reaction product of a phenol and/or cresol novolac type epoxy resins and 0.9-1.1 moles per mole of epoxy resins of an ethylenically unsaturated carboxylic acid in a limited proportion. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5364736-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5596024-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6780549-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5229252-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5070002-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4933259-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6469109-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002051942-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5916683-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5093223-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018188600-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5178988-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10816847-B2 |
| priorityDate |
1986-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |