| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c667003ba24a316013640aa90f658cdc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F38-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F41-042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-003 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F27-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F5-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F27-2804
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F27-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 |
| filingDate |
2019-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_735c8ec9f7a4c5e267d248054d263ba3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d60bdd6ab2176f2d75d82d7ef385b8b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b0bee0bcbd62061d5cf8642aa4a35f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c0778661612adb8ce930b0bdd06ca2c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c9cae1a0c88f34887f6a33478b578915
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4184c99e4f5562caf0b7b08b5ce4ac1 |
| publicationDate |
2022-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11387033-B2 |
| titleOfInvention |
High-aspect ratio electroplated structures and anisotropic electroplating processes |
| abstract |
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures. |
| priorityDate |
2016-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |