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publicationDate 2020-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10640879-B2
titleOfInvention High aspect ratio electroplated structures and anisotropic electroplating processes
abstract Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.
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