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publicationDate 2019-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-110140203-A
titleOfInvention High Aspect Ratio Plating Structures and Anisotropic Plating Processes
abstract Apparatuses including high aspect ratio plated structures and methods of forming high aspect ratio plated structures are described. A method of making a metal structure comprising: providing a substrate having a metal base, the metal base being characterized by a height to width aspect ratio A/B; and electroplating a metal crown on the base to form the metal structure, whereby The height to width aspect ratio A/S of the metal structure is greater than the aspect ratio A/B of the base.
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