| abstract |
The present invention provides a polyamide resin composition including (A) a polyamide resin, (B) an alkali metal compound and/or an alkaline earth metal compound, and (C) one or more compounds selected from following (C1) to (C4): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of periodic table, (C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and (C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), and (C4) an acid. |