Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_98f92c496e4f5c70f34681fb4bf526d2 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0792 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4813 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0271 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4483 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N29-2406 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0292 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N29-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B06B1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B8-00 |
filingDate |
2018-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2020-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_048db0aa319da11ac3d3c76671a9b01d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a05e9a4a3314a9dbf92800121f70680a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ded577b80a06de2133f3ca81364afef1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fca759faaaf0e67dc3443e9087bed922 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9016b59d3a299e608b7c390fa3eaa783 |
publicationDate |
2020-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10782269-B2 |
titleOfInvention |
Microfabricated ultrasonic transducers and related apparatus and methods |
abstract |
Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11684949-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10967400-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11559827-B2 |
priorityDate |
2014-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |