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filingDate 2019-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc0e3f14453db810e8921b6204ef4a7e
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publicationDate 2020-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I710760-B
titleOfInvention Silicon substrate analysis method
abstract A silicon substrate analysis method capable, with high accuracy, of analyzing impurities such as trace metals on a silicon substrate having a thick nitride film formed thereon by ICP-MS. More specifically, the analysis method employs a silicon substrate analysis equipment having a load port, a substrate transfer robot, an aligner, a drying chamber, a vapor- phase decomposition chamber, an analysis scan port having an analysis stage and a substrate analysis nozzle, an analysis solution collector, and an inductively-coupled plasma analyzer. The surface of the silicon substrate is scanned with a recovery solution, which is a mixture of hydrofluoric acid and hydrogen peroxide solution, by use of a substrate analysis nozzle to recover the recovery solution, and thereafter the recovery solution is discharged onto the surface of the silicon substrate, and the substrate is heated and dried. Then a strong acid solution or a strong alkaline solution is discharged onto the surface of the substrate, which is heated and dried, the surface of the silicon substrate is scanned with an analysis solution, the analysis solution is recovered and is analyzed by ICP-MS.
priorityDate 2018-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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