| abstract |
This article discloses a granular epoxy resin composition for encapsulating a semiconductor device, a method of encapsulating a semiconductor device, and a semiconductor device encapsulated with the granular epoxy resin composition. The average particle size of the granular epoxy resin composition is about 500 microns to about 1200 microns, the average particle diameter is after introducing 200 grams of the epoxy resin composition into a shaker, and then at 80 rpm After 10 minutes of classification, the opening size in the shaker is 150 microns, 250 microns, 355 microns, 500 microns, 600 microns, 850 microns, 1000 microns, 1700 microns, and 2000 as calculated by Equation 1. Micron sieves are stacked in this stated order. |