| abstract |
The present invention relates to a granular epoxy resin composition for encapsulation of semiconductor, which is used to form a semiconductor device for encapsulating semiconductor elements by compression molding, characterized in that: relative to the total epoxy resin composition for encapsulation of semiconductor, the particle size distribution determined by sieving using JIS standard sieve comprises 3 mass% or less of particles of 2 mm or above in size, 0.5 mass% or more to 60 mass% or less of particles from 1 mm or above to less than 2 mm in size, and 5 mass% or less of micro powder less than 106 μm in size. |