| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B11-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B9-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2016-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c20c3fe8ff8452663ba93cb7850efa24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47e4e781405cbe082e477df2976e5200
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2aeddb38682aa0c11f1c0cfe1f23c635
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0b8938ddc6c6f9db8ffe8f57a185e7e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a13f37237a5dc91012443f97652d2033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3072a5bb061d62c40bb06bea79a57073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a28c7bbd922e381e7a25e445415f315 |
| publicationDate |
2020-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I692066-B |
| titleOfInvention |
Method for manufacturing epoxy resin granular body for semiconductor sealing, epoxy resin granular body for semiconductor sealing, method for manufacturing semiconductor device, and semiconductor device |
| abstract |
According to the present invention, it is possible to provide a method for manufacturing epoxy resin granules for semiconductor sealing, which is a method for manufacturing epoxy resin granules for semiconductor sealing in a semiconductor device formed by sealing a semiconductor element by compression molding , Which includes the following steps: a step of preparing an epoxy resin composition for semiconductor sealing, a step of setting the epoxy resin composition for semiconductor sealing in an extrusion molding machine, and a self-extrusion molding machine by a thermal cutting method The step of cutting the front end of the resin block composed of the extruded epoxy resin composition for semiconductor sealing to obtain an epoxy resin granular material for semiconductor sealing, using an elevated flow rate tester The measured melt viscosity at 175℃ is 0.5Pa‧S or more and 20Pa‧S or less. |
| priorityDate |
2015-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |