http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1074779-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J2-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29B9-10
filingDate 1996-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c27da7d1eae0a6ab7a15a508e2466f7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ea6193d27d14f9c789d8caa47ec1f6d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1db7d1b2d5c754e4c7eeaec5aefc220
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6bc5ab0f0cb4928fbf005b57cf18b87f
publicationDate 1998-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H1074779-A
titleOfInvention Granular semiconductor sealing material, method for manufacturing the same, and semiconductor device using the material
abstract (57) [PROBLEMS] To provide a granular semiconductor encapsulating material using a pulverized material obtained by kneading a resin component and an inorganic filler and then pulverizing the same. Provided is a granular semiconductor encapsulating material that generates less fine powder. SOLUTION: A resin component is heated and melted and granulated in a substantially non-pressurized state. Further, a liquid material is added, and granulation is performed in a substantially non-pressurized state.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11142488-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014512938-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018006079-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I618733-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012105964-A
priorityDate 1996-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10470
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419510542
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419477881
http://rdf.ncbi.nlm.nih.gov/pubchem/anatomy/ANATOMYID210340
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414871446
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414972214
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419512635
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID335
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID70262
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID11318
http://rdf.ncbi.nlm.nih.gov/pubchem/taxonomy/TAXID210340
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID408721192
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410043847
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419518007
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7681
http://rdf.ncbi.nlm.nih.gov/pubchem/taxonomy/TAXID349346
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415744893
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412798128
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID962
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415735454
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12749
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID76476
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID70012
http://rdf.ncbi.nlm.nih.gov/pubchem/anatomy/ANATOMYID349346
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14094712
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69591
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415745782
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID66954

Total number of triples: 50.