| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b7317808024e524eea40a6c5a5ad6a22 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66553
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-4966 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2807
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66545
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66583
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-6659
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-4983 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-51 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-43
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8238 |
| filingDate |
2000-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_211f38ca26d8c582b3e4804692eb292e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1da3f779cfece3cf604765f7c28a0e4 |
| publicationDate |
2002-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-495980-B |
| titleOfInvention |
A method of manufacturing a semiconductor device |
| abstract |
In a method of manufacturing a semiconductor device comprising a transistor having a gate (22) insulated from a channel (13) by a gate dielectric (17). Which channel (13) is provided in an active region (4) of a first conductivity type provided at a surface (2) of a semiconductor body (1) and has a length L over which it extends between a source zone (11, 9) and a drain zone (12, 9) of a second conductivity type, the active region (4) of the first conductivity type is defined in the semiconductor body (1), and a dielectric layer (14) is applied which is provided with a recess at the area of the gate (22) planned to be provided at a later stage, in which recess an insulating layer is applied, forming the gate dielectric (17) of the transistor. Then, a first conductive layer and a second conductive layer are applied, the first conductive layer being relatively thin compared to the width of the recess, which first conductive layer and second conductive layer jointly form the gate (22) of the transistor and fill the recess in the dielectric layer (14). The gate comprises a central portion (21) and side end portions (19) positioned along either side of the central portion (21), which central portion (21) and side end portions (19) are in contact with the gate dielectric (17) and jointly establish a work function of the gate (22) varying across the length L of the channel (13). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I424567-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105304693-B |
| priorityDate |
1999-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |