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filingDate 2000-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2002-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0fff766b7a5d0a212d0603dfa4bba65
publicationDate 2002-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-473866-B
titleOfInvention Plasma CVD apparatus and plasma CVD method
abstract A remote plasma CVD apparatus is disclosed, in which oxygen gas 18 is supplied to a high frequency wave applying electrode 1 to cause reaction of oxygen radicals and oxygen molecules 21 with monosilane gas 19, which is introduced into part of a substrate processing zone R outside oxygen plasma 22. The apparatus comprises a plasma confining electrode 20, which has jetting holes for supplying monosilane gas 19 to the substrate processing zone R. The electrode 20 is spaced apart from a substrate 3 (i.e., deposition substrate) by a distance no longer than about 1,500 λg of the mean free path in the substrate processing zone R at the time of film formation. The member 20 has a hollow structure, and accommodates dispersing plates (i.e., a first and a second dispersing plate) for uniformalizing monosilane gas (i.e., neurtral gas) in it. Thus both of suppression of excessive progress of gas phase chemical reaction and homogeneous film formation in a remote plasma CVD apparatus for forming film by gas phase chemical reaction are realized.
priorityDate 1999-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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