| titleOfInvention |
Polyimine, adhesive, film-like adhesive material, adhesive layer, adhesive sheet, resin-attached copper foil, copper-clad laminate, printed wiring board, and multilayer wiring board and manufacturing method thereof |
| abstract |
The problem to be solved by the present invention is to provide a polyimide, an adhesive, a film-like adhesive material, an adhesive layer, an adhesive sheet, a copper foil with resin, a copper clad laminate, a printed wiring board, and a method for manufacturing the same. The solution of the present invention is to provide a polyfluorene imine, which is a reactant of a monomer group including an aromatic tetracarboxylic anhydride and a diamine, and includes a fluorenyl group in a polymer main chain, and the diamine includes Dimer diamine; an adhesive containing polyimide, a cross-linking agent, and an organic solvent; and, a film-like adhesive material, an adhesive layer, an adhesive sheet, a copper foil with resin, a copper clad laminate, printing Wiring board, multilayer wiring board and manufacturing method thereof. |