| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7c0d6738a637cf6c9f6ed8fa05996680 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5397
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3415
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3415
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2021-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0f184342b502dddaae0edeb77ed08b5 |
| publicationDate |
2021-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I748898-B |
| titleOfInvention |
Thermosetting resin compositions, flame-retardant resin compositions, liquid packaging material and its use, and film and its use |
| abstract |
The present invention provides a thermosetting resin composition which contains at least： (a) benzoxazine resin and (b) bismaleimide. The present invention provides a flame-retardant resin composition which contains at least：(a) benzoxazine resin, (b) bismaleimide, and (c) flame retardant. The thermosetting resin composition and the flame-retardant resin composition may be used as a constituent element of a semiconductor liquid packaging material, or an interlayer insulating film. |
| priorityDate |
2021-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |