http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I695865-B

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
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filingDate 2019-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_596e542c3dee18e836bfff55f4f0d5a3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_946fd327fb4bc028b1656ac0322a40b0
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publicationDate 2020-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I695865-B
titleOfInvention Primer composition, and metal-clad laminate and manufacturing method of the same
abstract A primer composition, and a metal-clad laminate and a manufacturing method of the same are provided. The utilization of the primer composition can form a primer layer onto a plastic substrate to enhance an adhesive force between a metal layer and the plastic substrate. The primer composition includes a polyimide resin, an effective content of hardener, and a solvent. A ratio of a dielectric constant (Dk) and a dielectric dissipation factor (Df) of the polyimide resin is ranging from 700 to 1200.
priorityDate 2019-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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