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filingDate 2018-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_502fd2e3553b2f7ef944e2155438fbee
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publicationDate 2020-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20200059419-A
titleOfInvention Method for treating substrate and apparatus for treating substrate
abstract The present invention provides a method for processing a substrate. In one embodiment, the substrate processing method includes the steps of bringing in a substrate having a contact hole formed on an insulating layer; Providing a first process gas to remove the natural oxide film; Oxidizing a damaged layer formed in the contact hole by providing a second process gas discharged and supplied in a plasma state; Providing a third process gas to remove the oxidized damaged layer; And carrying out the processed substrate.
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