| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc3e639586089fe232d0cfb27383c875 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H1-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-505
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32724
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-505
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-52 |
| filingDate |
2018-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_055e4330ba2ba0622e4fb56694ff1d99
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0310f989e4e4f642ddace61eb572d9d1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d918fadca407f5ae4286bb58e06c13cb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97ea1bd35f326449b6c665e759eb05dc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e279868c4a07e303c221ca170b4d964a |
| publicationDate |
2020-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20200020839-A |
| titleOfInvention |
Plasma treatment method and plasma treatment device |
| abstract |
The present invention addresses the improvement of productivity. Plasma treatment includes heating the substrate support disposed in the vacuum vessel to a first temperature. A first plasma is generated by a first discharge condition between the substrate support and the shower plate facing the substrate support, and the shower plate is heated by the heat and the first plasma of the substrate support. The temperature of the shower plate is monitored noncontact. After the temperature of the shower plate reaches a second temperature which is higher than the temperature heated by the heat of the substrate support, a process gas is injected from the shower plate toward the substrate support, and the process is performed between the substrate support and the shower plate. A second plasma is generated under two discharge conditions, and the substrate supported on the substrate support is processed by the second plasma. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023003768-A1 |
| priorityDate |
2017-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |