| abstract |
[PROBLEMS] To provide a technique capable of uniformly forming a film on a substrate to be processed regardless of the progress of the plasma processing for film formation. [MEANS FOR SOLVING PROBLEMS] A method according to an embodiment is a film forming method for forming a film on a pattern formed on a substrate to be processed, wherein the substrate to be processed is placed in a placing table provided in a plasma processable space under a reduced pressure environment, And an upper electrode which is opposed to and capable of supplying a high frequency power is arranged. The method includes a first step of forming a deposited film on a pattern of a substrate to be processed after performing a process of controlling the temperature of the main surface of the substrate to be processed in each of a plurality of regions of the main surface of the substrate to be processed, And a second step of cleaning the space by generating a plasma in the space, and repeats the sequence. |