http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180107592-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fa80eed27901ac84139c7a7109c21e17 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-60 |
| filingDate | 2017-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1dfe45567fef19554df337cf5c228d0a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85592090ca99201e4fa9246587b853a3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_340d4eb2d21570aed8c5ee63658561ee |
| publicationDate | 2018-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20180107592-A |
| titleOfInvention | Semiconductor device and semiconductor device package |
| abstract | The present invention relates to a semiconductor device, a semiconductor device manufacturing method, a semiconductor device package, and a method of manufacturing a semiconductor device package. A semiconductor device according to an embodiment includes a light emitting structure including a first conductive semiconductor layer and a second conductive semiconductor layer; A first bonding pad disposed over the light emitting structure and electrically connected to the first conductive semiconductor layer; A second bonding pad disposed on the light emitting structure and spaced apart from the first bonding pad and electrically connected to the second conductive semiconductor layer; A reflective layer disposed over the light emitting structure and disposed between the first bonding pad and the second bonding pad; . ≪ / RTI > According to the semiconductor device of the embodiment, each of the first bonding pad and the second bonding pad may include a porous metal layer disposed on the light emitting structure and including a plurality of pores, and a bonding alloy layer disposed on the porous metal layer. According to the embodiment, the bonding alloy layer may include a plurality of alloy layers containing a plurality of metal materials and having different material composition ratios. Wherein the bonding alloy layer comprises an alloy layer containing Au and Sn, and the second region, which is relatively farther from the porous metal layer than the first region, relative to the Au atomic composition ratio contained in the alloy layer disposed in the first region close to the porous metal layer, The Au atomic composition ratio of the alloy layer disposed in the Au layer can be smaller. |
| priorityDate | 2017-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.