| abstract |
A light emitting diode having a multilayer bonding pad having a bonding pad capable of performing both soldering and eutectic bonding and solving the problem of soldering is presented. The bonding pad includes a P1 layer for enhancing ohmic contact and adhesion under the light emitting structure, a P3 layer for preventing diffusion below the P1 layer, a Sn based based metal compound layer for improving soldering wettability and preventing oxidation, based P5 layer and a P4 layer that suppresses the reaction between the P3 layer and the P5 layer or a P4 layer that suppresses the reaction between the P3 layer and the P5 layer, An AuSn based metal compound layer for preventing eutectic oxidation, a P5 layer containing Cu as a main component for preventing the diffusion of Sn on the AuSn based metal compound layer, an AuSn based metal compound layer and a P5 layer A P6 layer for suppressing the reaction between the P5 layer and the remaining layer and a P4 layer for suppressing the reaction between the P5 layer and the remaining layer between the P3 layer and the P5 layer. |