| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1543b2b19ec0e331a0dcd89888cbef5f |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate |
2006-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6c6d8ac9d8b7cf2f319a183807f529c |
| publicationDate |
2008-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20080059397-A |
| titleOfInvention |
Polishing Fluids and CMP Methods |
| abstract |
In particular when used in fixed abrasive planarization techniques, various polishing compositions are provided that are useful for modifying surfaces such as semiconductor wafers suitable for the fabrication of semiconductor devices. The polishing composition contains a synergistic mixture of water, oxidant, complexing agent and metal ions. Various methods of planarization of the surface are also provided. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200020699-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160132923-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018004142-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180001390-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022060735-A1 |
| priorityDate |
2005-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |