| abstract |
The present invention is obtained by reacting an unsaturated group-containing mono carboxylic acid (d) with a reaction product (c) of a compound (a) having three or more phenolic hydroxyl groups and an alkylene oxide (b) in one molecule, Curable resin which has an unsaturated group and a carboxyl group in a side chain terminal, such as curable resin obtained by making e) and polybasic acid anhydride (f) react, is provided. By combining such a curable resin with a photopolymerization initiator, a photosensitive (meth) acrylate compound, an epoxy compound, a dilution solvent, another curable resin that is solid at room temperature having a carboxyl group and an unsaturated group in a molecule, a flame retardant, and the like, the solder resist of the printed wiring board and the multilayer wiring board The photocurable thermosetting resin composition useful for formation of an interlayer insulation layer etc. is obtained. |