http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100883047-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G63-21 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-062 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0048 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4292 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-029 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 |
| filingDate | 2007-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100883047-B1 |
| titleOfInvention | Photocurable thermosetting resin composition, its hardened | cured material, and printed wiring board |
| abstract | The photocurable and thermosetting resin composition which can provide the board | substrate which is excellent in the solder heat resistance, adhesiveness, electrical insulation, and HAST tolerance which are required as a resist for a semiconductor package board | substrate, and also has a hardening shrinkage and a non-flexion board | substrate even for an extremely thin core material. And the cured product thereof and a printed wiring board.n n n (A-1) Carboxyl group-containing photosensitive resin obtained by making polybasic anhydride (d) react with the reaction product of an epoxy compound (a), a compound (b), and an unsaturated group containing monocarboxylic acid (c), (A-2) The carboxyl group obtained by making compound (e) which has a phenolic hydroxyl group, alkylene oxide (f), or cyclocarbonate compound (g) react, and making unsaturated group containing monocarboxylic acid (c) and polybasic acid anhydride (d) react. Any one of carboxyl group-containing photosensitive resin obtained by making polybasic acid anhydride (d) react with the reaction product of containing photosensitive resin and (A-3) linear polyfunctional epoxy compound (h) and unsaturated group containing monocarboxylic acid (c). Species and (B) carboxyl group-containing urethane (meth) acrylate compound, (C) photoinitiator, (D) thermosetting component, and (E) diluent are contained.n n n Carboxyl group-containing photosensitive resin, dry film, solder resist |
| priorityDate | 2006-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 366.