http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110086814-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-161 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F299-024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-161 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0382 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0388 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-141 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
filingDate | 2009-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f88d42d2f097a208fe10aafbadf9341 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_debab755bbe7671f2fbe7142d1934cbe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c9909cccbb323d16ac4c9de00291885 |
publicationDate | 2011-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-20110086814-A |
titleOfInvention | Photocurable resin composition, its dry film, and hardened | cured material, and printed wiring board using these |
abstract | The present invention provides a photocurable resin composition, a dry film and a cured product thereof, which are excellent in the contact drying property of a dry coating film, highly sensitive and flexible, and particularly capable of forming a cured film having high insulation resistance during high temperature humidification. The printed wiring board in which hardened films, such as these, are formed is provided. Alkali developable photocurable resin composition contains the photosensitive resin containing the structure represented by following formula (I), carboxyl group-containing resin, and a photoinitiator. Preferably it further contains a thermosetting component, and preferably further contains a colorant. <Formula I> In the formula, R 1 is a hydrogen atom, an organic group having 1 to 20 carbon atoms, and may be the same or different, and R 2 is selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, an alkylene group having 1 to 10 carbon atoms, and a phenylene group. At least one functional group, R 3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R 4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R 5 represents a hydrogen atom or a methyl group, and p Represents an integer of 1 to 5, q represents an integer of 3 or more, m represents an integer of 1 to 4, and n represents an integer of 1 to 10. |
priorityDate | 2008-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 573.