http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102332799-B1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81024 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3612 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3457 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
filingDate | 2017-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2021-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2021-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-102332799-B1 |
titleOfInvention | Thermosetting flux composition and method for manufacturing electronic substrate |
abstract | The thermosetting flux composition of the present invention is a thermosetting flux composition for use in bonding electronic components having solder bumps made of a solder alloy having a melting point of 200°C or more and 240°C or less to an electronic substrate by reflow soldering, comprising: (A) oxetane A compound and (B) an active agent are contained, the component (A) contains (A1) a bifunctional oxetane compound having two oxetane rings in one molecule, and the component (B) contains (B1) an organic acid; , characterized in that the viscosity at a temperature of 200°C is 5 Pa·s or less, and the viscosity at a temperature of 250°C is 50 Pa·s or more when the temperature is increased from a temperature of 25°C to a temperature increase rate of 5°C/min. will be. |
priorityDate | 2017-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 141.