| abstract |
【Task】 Provided are a soldering flux composition and a solder paste capable of improving the bonding strength of electronic components to be mounted without causing foaming or cracks in the flux residue. [Solution] Contains rosin derivative (A) obtained by addition reaction of vinyl (thio) ether compound to ring-opened half esterified product of rosin alcohol and compound having one or more cyclic acid anhydride groups in one molecule A flux composition for soldering, characterized in that: Also, a solder paste comprising the same flux composition and solder powder. [Selection figure] None |