http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017100181-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate | 2015-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b55f87642668c1c9048561a74a0cd0c8 |
| publicationDate | 2017-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2017100181-A |
| titleOfInvention | Flux composition, solder paste composition, and electronic circuit board |
| abstract | PROBLEM TO BE SOLVED: To suppress crack generation and its progress by suppressing thermal deterioration of a flux residue even when used for an electronic circuit board placed in an environment where there is a large difference in temperature and a large thermal shock. Furthermore, the provision of a flux composition that does not hinder the performance such as meltability and wettability. SOLUTION: (A) A rosin resin, (B) an acrylic resin, (C) an activator, (D) a thixotropic agent, (E) an antioxidant, and (F) a solvent, As the inhibitor (E), it comprises (E-1) a phenolic antioxidant, (E-2) a triazole antioxidant, and (E-3) a phosphorus antioxidant. Flux composition. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7130564-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020110833-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2021102232-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020192549-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020192545-A |
| priorityDate | 2015-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.