http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013173819-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-10
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-488
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
filingDate 2012-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_805c8023faf5b99603fd48ddcdedeb4e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aedcb02629906e9efb0c32a59218411b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f74de609fa36253ccf171c3640beb6a7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_382dba0a51cd7140bd4ed033f68d3abd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6977f5b4f1ebd8b6e4e03784dd60f304
publicationDate 2013-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2013173819-A
titleOfInvention Thermosetting resin composition
abstract The present invention relates to a method for bonding package components that can ensure the bonding strength between a package component having solder balls and a mounting substrate by a simple method, and can be suitably used for the method for bonding package components. A functional resin composition is provided. A thermosetting resin composition 31 is a thermosetting resin composition used in a method for joining package parts, which includes a film forming step, a resin composition attaching step, a mounting step, and a reflow step. An epoxy resin, an organic acid, and a thixotropic agent are contained, and the epoxy resin contains a dimer acid type epoxy resin. [Selection] Figure 3
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017064783-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102332799-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180106815-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018157007-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017033931-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10294324-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016084706-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016102165-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104425389-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016158828-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016158828-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018053056-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170038675-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102554070-B1
priorityDate 2012-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012084845-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003100810-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415795473
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21226588
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID94932
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID17162
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID92960
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID421303559
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID18674575
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415717720
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10219741
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID13589
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414881640
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415777488
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID83658
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414880258
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID11586419
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414886399
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426444792
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414862618
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID421175740
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID18360
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12619668
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415730115
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456028012
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID17049
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID31217
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415792153
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID19919
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426180740
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16606
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID61831
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414873588
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID20250632
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID456367111
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414881275
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID7838
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414002907
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12284
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414883979
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID420871390
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID413898522

Total number of triples: 77.