abstract |
The present invention relates to a method for bonding package components that can ensure the bonding strength between a package component having solder balls and a mounting substrate by a simple method, and can be suitably used for the method for bonding package components. A functional resin composition is provided. A thermosetting resin composition 31 is a thermosetting resin composition used in a method for joining package parts, which includes a film forming step, a resin composition attaching step, a mounting step, and a reflow step. An epoxy resin, an organic acid, and a thixotropic agent are contained, and the epoxy resin contains a dimer acid type epoxy resin. [Selection] Figure 3 |