| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13566 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2011-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_382dba0a51cd7140bd4ed033f68d3abd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f74de609fa36253ccf171c3640beb6a7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aedcb02629906e9efb0c32a59218411b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_805c8023faf5b99603fd48ddcdedeb4e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e1d8d4a796e2d43b3a0c427e8a124c9 |
| publicationDate |
2012-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012084845-A |
| titleOfInvention |
Method for joining package parts and thermosetting resin composition used in the method |
| abstract |
The present invention provides a bonding method for package components, which can ensure the bonding strength between a package component having solder balls and a mounting substrate by a simple method. A method for joining package components is a method for joining package components in which a package component having solder balls is joined to a mounting substrate, which is made of a thermosetting resin composition and has a thickness that is the height dimension of the solder balls. Film forming step of forming a resin composition film that is 20% or more and 90% or less with respect to the above, and the solder balls 11 of the package component 1 are immersed in the resin composition film, whereby the thermosetting resin composition A resin composition adhering step for adhering 31 to the solder balls, a mounting step for mounting the package component with the thermosetting resin composition adhering on the bonding lands 21 of the mounting substrate 2, and a reflow step. Prepare. [Selection] Figure 3 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013173819-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105636740-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9925612-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018110106-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105636740-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10522493-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9627345-B2 |
| priorityDate |
2010-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |