http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101553423-B1

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filingDate 2008-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2015-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2015-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101553423-B1
titleOfInvention Film adhesive for semiconductor vacuum processing apparatus
abstract There is provided a bonded assembly for reducing particulate contaminants in a semiconductor vacuum chamber, such as a plasma processing apparatus, comprising an elastomeric sheet adhesive bond between the mating surfaces of the component and the support member to provide thermal stress. The elastomeric sheet comprises a silicone tackifier to withstand a high shear strain of 800% in a temperature range between room temperature and 300 ° C, such as a thermosetting, high molecular weight dimethyl silicone with a selective filler. The sheet form has a bond thickness control for the parallel relationship of the bonded surfaces. The sheet adhesive can be cut into preform shapes to match regularly or irregularly shaped features and to maximize the surface contact area with the engagement surfaces, and can be installed in the cavity. The installation can be done manually, by installation tooling, manually, or by automated machining. The multiple layers of sheet tackifier having different physical properties can be laminated or can be coplanar.
priorityDate 2007-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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