http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101389828-B1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
filingDate 2012-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2014-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101389828-B1
titleOfInvention Abrasive additives and slurry compositions comprising them
abstract The present invention relates to a polishing additive, a slurry composition comprising the same, and a polishing method using the slurry composition. When the polishing process is performed using the slurry composition of the present invention, the conductivity is improved to activate the ionization of the slurry composition, It is possible to improve the polishing rate of the center portion and increase the polishing selectivity of the oxide film to the nitride film while securing an excellent polishing rate by the action of the anionic polymer and the ammonium salt.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10428242-B2
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priorityDate 2012-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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