http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080036051-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ee1c19da359446fb5c4f0458a57b783d http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ef81696280b2570ffaf564c1a572e5a7 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0786 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-025 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
filingDate | 2006-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae00bfe8b084938fbe38cfabec4670bf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edd0e9d4f6b17e7c4603758d9f9345b3 |
publicationDate | 2008-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-20080036051-A |
titleOfInvention | Abrasive Composition and Polishing Method |
abstract | Provided is an abrasive composition capable of minimizing the occurrence of scratches on a to-be-grinded object such as a resin substrate or a metal wiring and polishing at a high speed. Moreover, the grinding | polishing method which can minimize the generation | occurrence | production of the damage | wound to a resin base material and a metal wiring, and can improve throughput is provided.n n n The abrasive composition T is an abrasive composition containing an oxidizing agent, an electrolyte, and an aqueous medium, wherein the ions produced by the electrolyte are selected from the group consisting of ammonium ions, polyvalent carboxylic acid ions, and hydroxy carboxylic acid ions. It is characterized by consisting of at least one or more organic carboxylic acid ions, and at least one ion selected from the group consisting of carbonate ions, hydrogen carbonate ions, sulfate ions and acetate ions. After the wiring groove 2 is formed in the resin substrate 1 and the wiring metal 3 is embedded in the wiring groove 2, the wiring metal 3 is polished using the above abrasive composition. Thereby, the generation | occurrence | production of the damage to the resin base material 1 and the metal wiring 3 can be minimized, and the throughput can be improved. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101389828-B1 |
priorityDate | 2005-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 89.