http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080036051-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ee1c19da359446fb5c4f0458a57b783d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ef81696280b2570ffaf564c1a572e5a7
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-025
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
filingDate 2006-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae00bfe8b084938fbe38cfabec4670bf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_edd0e9d4f6b17e7c4603758d9f9345b3
publicationDate 2008-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20080036051-A
titleOfInvention Abrasive Composition and Polishing Method
abstract Provided is an abrasive composition capable of minimizing the occurrence of scratches on a to-be-grinded object such as a resin substrate or a metal wiring and polishing at a high speed. Moreover, the grinding | polishing method which can minimize the generation | occurrence | production of the damage | wound to a resin base material and a metal wiring, and can improve throughput is provided.n n n The abrasive composition T is an abrasive composition containing an oxidizing agent, an electrolyte, and an aqueous medium, wherein the ions produced by the electrolyte are selected from the group consisting of ammonium ions, polyvalent carboxylic acid ions, and hydroxy carboxylic acid ions. It is characterized by consisting of at least one or more organic carboxylic acid ions, and at least one ion selected from the group consisting of carbonate ions, hydrogen carbonate ions, sulfate ions and acetate ions. After the wiring groove 2 is formed in the resin substrate 1 and the wiring metal 3 is embedded in the wiring groove 2, the wiring metal 3 is polished using the above abrasive composition. Thereby, the generation | occurrence | production of the damage to the resin base material 1 and the metal wiring 3 can be minimized, and the throughput can be improved.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101389828-B1
priorityDate 2005-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415861834
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID222
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID407832258
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410637402
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID4342083
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8197
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID175
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID448021919
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419474445
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9989226
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID66644
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID447653313
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID1110
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID444972
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID1117
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410135424
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID25251
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID407364031
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419964171
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID769
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452505745
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559376
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412584818
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID447690813
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID67519
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6419706
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419474255
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID169042
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID19990
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419474094
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID311
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419474096
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID12432
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453265332
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID30081
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID406954885
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID447959208
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583152
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414170355
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451818717
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID406903349
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419484094
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID82220
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID757
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457765275
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID20467
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID784
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID971
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24538
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID138107
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419474387
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID165228
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419550829
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6454490
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451867047
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID31294
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID10480
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14013
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453148806
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID426111853
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID867
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID447827115
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419698070
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID19660

Total number of triples: 89.