http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100896794-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aafe0172ffd94d3486c518b0709bb2b3 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3218 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-544 |
| filingDate | 2007-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f247feacf32edc528799832c688fe83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64cbb256d9e933cd853cdb12e1e89d3a |
| publicationDate | 2009-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100896794-B1 |
| titleOfInvention | Epoxy resin composition for sealing semiconductor device and semiconductor device using same |
| abstract | The present invention relates to an epoxy resin composition for semiconductor element encapsulation and a semiconductor element sealed using the same. The present invention relates to an epoxy resin composition comprising an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a coupling agent. By using an aromatic epoxy resin and a phenol aralkyl type epoxy resin together and using an epoxy silane coupling agent and an amino silane coupling agent together as said coupling agent, the bending element of a package is excellent in reliability and reliability, and has excellent moldability and flame retardancy. Can be provided.n n n Semiconductor, epoxy, polyaromatic epoxy resin, phenol aralkyl type epoxy resin, epoxy silane coupling agent, amino silane coupling agent, bending property, reliability, formability, flame retardancy |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101882564-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170068717-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101293791-B1 |
| priorityDate | 2007-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 100.