http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101293791-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5415 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2011-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101293791-B1 |
| titleOfInvention | Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same |
| abstract | The present invention relates to an epoxy resin composition for sealing semiconductor elements comprising a polyalkylene glycol-based alkoxysilane as a coupling agent. Epoxy resin composition of the present invention is excellent in the reliability associated with the occurrence of package cracking or peeling by increasing the adhesion to the metal element, high fluidity during multi-chip filling and no void generation, excellent moldability. |
| priorityDate | 2011-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.