| abstract |
(A) Epoxy resin, (B) Phenolic resin, (C) Inorganic filler, (D) Curing accelerator, and (E) Surface-treated colorant, The coloring agent before the said surface treatment has a carbon content of 90 weight% or more The epoxy resin composition for semiconductor sealing whose carbon precursor or DBP absorption amount is carbon black of 100 cm <3> / 100g or more, and the semiconductor device which seals a semiconductor element using this. According to the present invention, it is possible to provide an epoxy resin composition for semiconductor encapsulation that does not cause electrical defects such as short circuits, leak defects, wire deformation, or the like, and which has excellent laser marking properties. |