http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100800647-B1

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28061
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-4941
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336
filingDate 2006-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2008-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbdd0965f659eb6451876a76e537210a
publicationDate 2008-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100800647-B1
titleOfInvention Gate electrode formation method of semiconductor device
abstract The present invention relates to the production of a new polyside gate electrode in which an amorphous TiSiN layer is formed between a polysilicon layer and a tungsten silicide layer in a conventional polyside gate to prevent florin diffusion. Since TiSiN is formed on the top of the polysilicon layer, it is possible to prevent florin generated during the deposition of tungsten silicide from penetrating into the gate oxide film, thereby preventing deterioration of the gate oxide film by florin.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8847300-B2
priorityDate 2006-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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