Predicate |
Object |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32623 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4585 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-505 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-458 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205 |
filingDate |
2005-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2008-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2008-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-100792461-B1 |
titleOfInvention |
Method and apparatus for reducing arc during plasma treatment |
abstract |
In a first aspect, a method for use during plasma processing is provided. The first method includes (1) placing a substrate on a substrate holder of a plasma chamber; (2) placing a cover frame adjacent to and beneath the substrate; And (3) using the cover frame to reduce arc during plasma processing in the plasma chamber. Many other suns are provided. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-200492981-Y1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101558771-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170000175-U http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101615608-B1 |
priorityDate |
2004-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |