http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018025850-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 |
| filingDate | 2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2018025850-A1 |
| titleOfInvention | Resin composition |
| abstract | The present invention provides a resin composition which is liquid before curing, and the cured product maintains a high elastic modulus in the working temperature range of a semiconductor device, so that cracking and peeling do not easily occur even when used for a long time. A thermosetting resin composition comprising a thermosetting resin and a curing catalyst, wherein the viscosity at 25 ° C. and a shear rate of 0.009 s −1 is 1500 Pa · s or less, and the cured product of the thermosetting resin composition The storage elastic modulus at 25 ° C. and 180 ° C. is 1.0 × 10 8 Pa or more, and the ratio a / b of the volume resistivity a at 25 ° C. to the volume resistivity b at 200 ° C. is 8500 or less The resin composition to be characterized. |
| priorityDate | 2016-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 284.