| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate |
2011-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fcbb9358b4680cae9780b29298662ab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ec2803beaa40412e6d5ee1caf8cfe34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d87d436262a1d7ed79b939f35f1b59b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a09cc98e04212838f3a33ca717691fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aacf4b2652015547f77e01dc035e02be |
| publicationDate |
2012-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2012255125-A |
| titleOfInvention |
Thermosetting resin composition, semiconductor device member, and semiconductor device using the same |
| abstract |
An object of the present invention is to provide a semiconductor device member having excellent gas barrier properties and adhesion. A thermosetting resin composition comprising the following (A) to (D), wherein the sum of epoxy equivalents of (A) polysiloxane and (B) epoxy compound contained in the thermosetting resin composition is: The storage elastic modulus at 150 ° C. by dynamic viscoelasticity measurement of the cured product formed by heat-treating the thermosetting resin composition is 200 to 700 g / equivalent to 1.40 × 10 7 to 1. A thermosetting resin composition characterized by being 20 × 10 9 Pa. (A) Polysiloxane having an epoxy equivalent of 350 to 1000 g / equivalent to polysiloxane and represented by the following formula (1) (R 1 R 2 R 3 SiO 1/2 ) a (R 4 R 5 SiO 2/2 ) b (R 6 SiO 3/2 ) c (SiO 4/2 ) d (OR 7 ) (1) (B) Epoxy compound (C) Curing agent (D) Curing catalyst [Selection] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018016796-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018047758-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018016405-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016086086-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018025850-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014516101-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021284903-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013057001-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9354518-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018044158-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3511611-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015120899-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109690367-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018025850-A1 |
| priorityDate |
2011-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |