http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2008123248-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0264 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2309-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2309-12 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4673 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2008-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2008123248-A1 |
| titleOfInvention | Insulating sheet with substrate, multilayer printed wiring board, semiconductor device, and method for manufacturing multilayer printed wiring board |
| abstract | When used for an insulating layer of a multilayer printed wiring board, the base material can be peeled from the insulating sheet without difficulty, and the insulating sheet with the base material that does not cause cracking or falling off of the insulating layer, the multilayer printed wiring board, A semiconductor device is provided. An insulating sheet with a base material used for forming an insulating layer of a multilayer printed wiring board, wherein an insulating layer made of a resin composition is provided on a base material, and the insulating layer is heated on an adherend surface. After the adhesive layer is pressed and bonded, and the insulating layer is heated and cured, the peel strength for peeling the substrate from the insulating layer is 0.2 kN / m or less, and the insulating layer is peeled from the substrate after heat curing. An insulating sheet with a base material characterized by being used as a base material, and an insulating layer made of a resin composition is provided on the base material, and the insulating layer is attached to the adherend surface at 60 to 160 ° C., When heated and pressurized at 0.2 to 5 MPa for 0.5 to 15 minutes, the peeling strength for peeling the substrate from the insulating layer at 20 ° C. is 0.05 kN / m or less. Insulating sheet with substrate. |
| priorityDate | 2007-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 61.