| abstract |
PROBLEM TO BE SOLVED: To provide a method for producing a multilayer printed wiring board excellent in reliability and capable of forming an outer layer conductor circuit excellent in smoothness and adhesion to an insulating resin layer. A method of manufacturing a multilayer printed wiring board by forming an insulating resin layer on a surface of an inner layer circuit board on which an inner layer conductor circuit is formed, and forming an outer layer conductor circuit on an outer surface of the insulating resin layer. There, (A) Insulating resin layer material formed from a resin composition containing a curable resin and having a first exothermic peak and a second exothermic peak located at a higher temperature in differential scanning calorimetry, Forming an insulating resin layer on the inner circuit board by stacking and integrating on the inner circuit board; (B) forming a concavo-convex shape on the outer surface of the insulating resin layer; (C) a step of forming an outer layer conductor circuit on the formed uneven surface, and (D) a step of performing a heat treatment after forming the outer layer conductor circuit; A method for producing a multilayer printed wiring board, comprising: [Selection figure] None |