| abstract |
(57) [Summary] The present invention is an interlayer adhesive film for a multilayer printed wiring board having an inner layer circuit and being embedded on an inner layer circuit board. [Objective] In the manufacture of a build-up type multilayer printed wiring board in which conductive circuit layers and insulating layers are alternately stacked, Development of a highly productive adhesive film that can simultaneously cover the inner layer circuit pattern and fill the resin in the through-holes and / or surface via holes simultaneously. An adhesive film comprising a support base film for laminating on a patterned inner layer circuit board and a resin composition at room temperature, wherein the resin composition at room temperature has a softening point lower than the lamination temperature. At least 10% by weight or more, formed on the supporting base film with a thickness equal to or greater than the conductor thickness of the inner circuit, and the resin flow of the resin composition at the lamination temperature causes the conductor thickness of the inner circuit and the inner layer to flow. Half the circuit through-hole depth and / or Alternatively, there is provided an interlayer adhesive film for a multilayer printed wiring board having a depth equal to or greater than a surface via hole depth, and a method for manufacturing a multilayer printed wiring board using the same. |