http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11188614-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8fb9f44db08d1c42a53f3d28eaae416f
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
filingDate 1997-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_809cb2161f2ee814aabe8037f7087da4
publicationDate 1999-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11188614-A
titleOfInvention Polishing method of workpiece
abstract (57) [Summary] [PROBLEMS] To perform a multi-stage polishing process using the same polishing machine. An object of the present invention is to provide a method for polishing a workpiece, which can be performed at a high speed and a low surface roughness, and in particular, a method for polishing a workpiece suitable for polishing a brittle material such as a glass material, a carbon substrate, and a ceramic material. SOLUTION: The method of the present invention for polishing a workpiece while supplying a polishing liquid containing polishing abrasive grains, a polishing aid, and water comprises a polishing aid (A) capable of improving a polishing rate as the polishing aid. The first polishing step is performed while supplying the first polishing liquid containing -1), and then, after the supply of the first polishing liquid is stopped, in the same polishing apparatus as the first polishing step, As the polishing aid, a polishing aid (A-A) capable of lowering the surface roughness of a workpiece and dispersing abrasive grains and polishing debris in a polishing liquid. It is characterized in that the second polishing step is performed while supplying the second polishing liquid containing 2).
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priorityDate 1997-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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