| abstract |
[PROBLEMS] A new CMP slurry which is essentially free of potential integrated circuit contaminants and has a high polishing rate, and is stable for a long time after the composition and the slurry are prepared. Novel CMP slurries and compositions that are active at A chemical mechanical polishing precursor composition comprising one or more catalysts having a multi-oxidation state and one or more stabilizers, prior to use in removing a metal layer from a substrate. Compositions that are useful when mixing oxidizing agents. Also, a composition useful when combined with an abrasive or abrasive pad for removing metals from a substrate. |