| abstract |
(57) Abstract: Provided are an epoxy resin molding material for semiconductor encapsulation, which has excellent moldability and is highly reliable without cracks or interfacial peeling during soldering, and a method for producing the same. SOLUTION: A crystalline epoxy resin having a melting point of 50 to 150 ° C., a phenol resin curing agent having a melt viscosity at 150 ° C. of 5 poise or less, a curing accelerator, and a melt surface-treated in advance with an amino group-containing silane coupling agent. Silica powder, An epoxy resin molding material for semiconductor encapsulation, which comprises an epoxy group-containing silane coupling agent and / or a mercapto group-containing silane coupling agent as an essential component, and a method for producing the same. |